Longsys delivers the P900, the industry’s first 11.5x13mm NVMe BGA SSD that supports the Boot Partitions function and the Host Memory Buffer feature to enable a new generation of high performance, cost effective mobile storage
SHENZHEN, China and SANTA CLARA, Calif., Aug. 8, 2017 /PRNewswire/ —
Longsys, a world leader in consumer flash storage, today announced expansion of its DRAM-less SSD product line from Serial ATA (SATA) interface to Non-Volatile Memory Express (NVMe) interface. Boot Partitions, an NVMe revision 1.3 feature, integrates BIOS/UEFI system inside an SSD and gives the host an option to simplify system design without SPI Flash. Host Memory Buffer (HMB) feature enables DRAM-less SSDs to use host memory and achieves performance comparable to SSD designs with embedded DRAM but at much lower cost and power consumption. Powered by Marvell’s 88NV1160 SSD controller, the Longsys P900 marks the industry’s first SSD that supports small 11.5mmX13mm BGA SSD with HMB. Furthermore Longsys is collaborating with other leaders in the ecosystem to accelerate the adoption of HMB-enabled SSDs for a new generation of low power, small form factor mobile computing systems.
“As the world’s leading Mini SDP (http://t.cn/R9h0aI0) SATA DRAM-less SSD module provider, Longsys has once again made a unique contribution to the storage industry by pioneering the integration of Marvell’s DRAM-less SSD controller 88NV1160 and the new 64-layer 3D NAND into a 11.5mmX13mm BGA package,” said Zhixiong Li, Chief Technology Officer of Shenzhen Longsys Electronics Limited. “Longsys’ new P900 SSD takes advantage of the leading DRAM-less NVMe design from Marvell along with the high-density 64-layer 3D NAND, which greatly enhances system memory utilization, reduces total system cost, lowers power consumption and provides consumers with a new class of mobile computing devices. I am very pleased with our ongoing…